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Semiconductor manufacturing

Precision, speed, reliability and miniaturization are synonymous with semiconductor manufacturing. This makes Xeryon's ultrasonic piezo products a highly suitable choice.

We have extensive experience with both semiconductor R&D and manufacturing applications.

Example applications

• Pick and place heads
• Die bonding alignment
• Inspection & metrology
• Test handlers
• Wafer positioning & scanning
• Tool & objective positioning
• And many more...

Fast & precise

Xeryon's actuators and stages stand out in the market for their exceptional speed, precision and compactness, boasting the capability to achieve submicron positioning at a rapid pace of up to 400 mm/s in a small envelope.

They are designed for high efficiency, with very low settling times reaching down to 20 milliseconds, and ensure high repeatability. This combination of features facilitates increased throughput without compromising on the quality required in manufacturing processes.

Stackable & ultra compact

Furthermore, Xeryon's miniature actuators are characterized by their remarkably small size and light weight, with dimensions as narrow as 6 mm in width and a mass of merely 6 grams.

This allows for actuator array downsizing, manipulator weight reduction and system design simplification.